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院士簡歷


Division of Engineering Sciences


院士相片
Chen-Hua Douglas Yu 余振華
Election Year 2024
Department of Electrical and Computer Engineering
College of Design and Engineering, NUS
4 Engineering Drive 3, Singapore 117583

Current Positions
  • Professor of Practice, National University of Singapore
Education
  • B.S. Physics, National Tsing-Hua University, HsinChu, Taiwan (1977)
  • M.S. Materials Science and Engineering, National Tsing-Hua University, HsinChu, Taiwan (1979)
  • Ph.D. Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA (1987)
Professional Experience
  • AT&T Bell Labs, Allentown, PA, USA. Member of Technical Staff/Project Leader (1987-1994)
  • TSMC, Advanced Module Development, Manager, Dep. Director, Director, and Sr Director (1994-2008)
  • TSMC, Integrated Interconnect and Packaging Technology Development, Sr. Director (2008-2016)
  • TSMC, Integrated Interconnect and Packaging Technology Development, Vice President (2016-2020)
  • TSMC, Pathfinding of System Integration technology, Distinguished Fellow and VP, (2020-now)
  • National University of Singapore, Professor of Practice (2026-now)
Specialties
  • Semiconductor processing and advanced packaging technologies
Awards and Honors
  • Dr. Morris Chang Award 2000, 2002, 2004, and 2010
  • National Invention Award, Taiwan Ministry of Economic Affair, 2001
  • Outstanding Scientific and Technical Award, National Science Council, Executive Yuan, Taiwan 2003
  • Outstanding Engineer, Chinese Institute of Engineer, 2009
  • IEEE Fellow 2013
  • President Science Prize, Taiwan, Applied Science, 2017,
  • IEEE Electronics Manufacturing Technology Award, IEEE Electronics Packaging Society 2018
  • 3D Incites Award- Engineer of the Year 2020
  • TSMC Distinguished Fellow (TSMC highest technical level, leading Senior Fellow, Fellow and Academician) 2020
  • IEEE Rao Tummala Electronic Packaging Award (IEEE/EPS Technical Field Award) 2022, for establishing TSMC 3DFabricTM Technology Platform consisting of CoWoS®, InFO and SoIC®.
  • Elected Member, National Academy of Engineering USA 2023