院士簡歷
Current Positions
- Distinguished Fellow and R&D Vice President, TSMC
- B.S. Physics, National Tsing-Hua University, HsinChu, Taiwan (1977)
- M.S. Materials Science and Engineering, National Tsing-Hua University, HsinChu, Taiwan (1979)
- Ph.D. Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA (1987)
- AT&T Bell Labs, Allentown, PA, USA. Member of Technical Staff/Project Leader (1987-1994)
- TSMC, Advanced Module Development, Manager, Dep. Director, Director, and Sr Director (1994-2008)
- TSMC, Integrated Interconnect and Packaging Technology Development, Sr. Director (2008-2016)
- TSMC, Integrated Interconnect and Packaging Technology Development, Vice President (2016-2020)
- TSMC, Pathfinding of System Integration technology, Distinguished Fellow and VP, (2020-now)
- Semiconductor processing and advanced packaging technologies
- Dr. Morris Chang Award 2000, 2002, 2004, and 2010
- National Invention Award, Taiwan Ministry of Economic Affair, 2001
- Outstanding Scientific and Technical Award, National Science Council, Executive Yuan, Taiwan 2003
- Outstanding Engineer, Chinese Institute of Engineer, 2009
- IEEE Fellow 2013
- President Science Prize, Taiwan, Applied Science, 2017,
- IEEE Electronics Manufacturing Technology Award, IEEE Electronics Packaging Society 2018
- 3D Incites Award- Engineer of the Year 2020
- TSMC Distinguished Fellow (TSMC highest technical level, leading Senior Fellow, Fellow and Academician) 2020
- IEEE Rao Tummala Electronic Packaging Award (IEEE/EPS Technical Field Award) 2022, for establishing TSMC 3DFabricTM Technology Platform consisting of CoWoS®, InFO and SoIC®.
- Elected Member, National Academy of Engineering USA 2023